Sealant DOWSIL
7094 Old name Dow Corning 7094
Old name Dow Corning 7094
Description
DOWSIL 7094 is a black, low modulus silicone adhesive/sealant designed for applications where a flowable product and non corrosive cure with durable adhesion to a variety of substrates is required.
Operating temperatures
-50°C +180°C
Pre-packing
310ml22kg220kg
- Applications
- Advantages
- Features
Applications
FEATURESOne component adhesive/sealant
Cures at room temperature when exposed to moisture in the air
Alkoxy cure system
Flowable and self leveling
Easy to apply
Excellent unprimed adhesion to many substrates
Stable and flexible from -50°C to +180°C
APPLICATIONS
Sealing and bonding applications where low viscosity and self leveling properties in combination with non-corrosive cure is required
Designed for applications which demand a strong but flexible bond such as when bonding materials with differing thermal expansion rates e.g., glass to metal or glass to plastic
Low modulus formulation for high movement capability
Sealing in gaps where an elastic grouting is required
Advantages
- Neutral curing system
| Стандарт | Показатель | Ед. изм. | Значение |
|---|---|---|---|
| — | Цвет | Черный | |
| — | Внешний вид (консистенция) | Вязкая жидкость | |
| — | Диапазон рабочих температур | °С | от -50 до +180 |
| CTM 0050 | Динамическая вязкость при 25 °С | Па*с | 28 |
| CTM 0098 | Время до образования первичной пленки | мин | 25 |
| CTM 0095A | Время сушки до потери липкости (при температуре 23°С и относительной влажности 50%) | мин | 50 |
| CTM 0137A | Предел прочности на разрыв | МПа | 1,2 |
| CTM 0137A | Относительное удлинение при разрыве | % | 400 |
| CTM 0099 | Твердость по Шору А | 19 | |
| — | Модуль упругости | МПа | 0,3 |
| — | Срок годности | дней | 360 |