Applications

FEATURES

One component adhesive/sealant
Cures at room temperature when exposed to moisture in the air
Alkoxy cure system
Non sag, paste consistency
Easy to apply
Excellent unprimed adhesion to many substrates
Stable and flexible form –50°C to +150°C

APPLICATIONS

Sealing and bonding applications where translucent and non-corrosive cure is required
Low modulus formulation for high movement capability